Electromagnetic vector sensors (emvs) apparatus method and system

ABSTRACT

An electromagnetic vector sensor (EMVS) system, having a plurality of EMVS devices consisting of a plurality of loop antenna elements spatiatally orthogonally integrated with and electrically isolated from a plurality of dipole antenna elements, mounted on a rotatably adjustable platform having a true north orientation, including active circuitry residing in antenna housings, and external executing software programs causing the active circuitry in cooperation with the EMVS device and receivers to determine angle of arrival and resolution of incoming wave vectors and polarization of incoming signals and to perform accurate high frequency geolocation signal processing; the programs which perform calibration and antenna element placement determination operations, also cause the system to collect data of known transmitted high frequency skywave signals, and estimate direction of arrival of unknown signals by detecting, resolving and measuring components of an electric field and a magnetic field at a single point.

RELATED APPLICATIONS

This U.S. patent application is related to U.S. Provisional Application for Patent No. 61/788,650 for Electromagnetic Vector Sensors (EMVS) Apparatus Method and System, filed on Mar. 15, 2013 (Mar. 15, 2013), having the same inventor or joint inventor as the instant application, and where the afore mentioned provisional application for patent is incorporated by reference and relied upon herein in its entirety.

FIELD OF THE INVENTION

The present invention relates in general to radio communications and antenna devices which can be used in direction finding applications. More particularly, this invention provides a simple means to integrate a series of dipole elements with a series of loop elements such that electromagnetic interactions between the dipole and loop elements are minimized.

BACKGROUND OF THE INVENTION

The ability to discriminate polarization states of an incoming wavefront has led to the development of various sensor designs which can be utilized to extract polarization information from an incoming signal. With advances in detection processing techniques, these sensors can also be used to provide increased accuracy in determining the direction-of-arrival of unknown signals. The development of electromagnetic vector sensors, as disclosed herein, enables new processing techniques to be utilized in real life situations.

Current direction finding devices, used in the field having mutual orthogonal axial elements, include vector sensors. There have been several multi-element sensing antennas designed and utilized in the field that provide HF radio wave direction finding capabilities. In addition, these multi-element sensing devices utilize various processing algorithms to accurately determine angle of arrival and thus require the multiple elements to be spatially orthogonal to each other, which in turn requires a high degree of isolation between the multiple loop and dipole antenna elements. However, current devices exhibit poor isolation characteristics between the multiple antenna elements (i.e., the dipole and loop elements) and inadequately resolve incoming wave vectors in elevation and azimuth directions, because of the requirement that the multiple elements be spatially and electrically orthogonal.

Therefore, the need exists for an electromagnetic vector sensor device which facilitates data collection of known transmitted high frequency skywave signals for purposes of achieving high frequency geolocation signal processing, using electromagnetic vector sensors (EMVS) direction-of arrival estimation of unknown signals, by measuring three complete components of the electric field and three components of the magnetic field at a single point.

Furthermore, the need exists for an electromagnetic vector sensor device having a series of loops and a series of dipoles configured spatially orthogonal to each other in such a manner as to maintain a high degree of isolation between the dipole and loop elements.

Further, the need exists for the electromagnetic vector sensor device to utilize various processing algorithms to accurately determine angle of arrival and to be able to clearly resolve, to a high degree of accuracy, incoming wave vectors and polarization of incoming signals, by minimizing interactions between dipole and loop elements.

SUMMARY OF THE INVENTION

An electromagnetic vector sensor (EMVS) system, as disclosed herein, comprises a plurality of EMVS devices each consisting of a plurality of loop antenna elements spatially and orthogonally integrated with a plurality of dipole antenna elements, while maintaining electrical isolation from the plurality of dipole antenna elements. This EMVS configuration of spatially orthogonally integrated antenna elements is mounted on a rotatably adjustable platform having a true north orientation; further having active circuitry residing in antenna holding housings to couple the RF signals from the loops/dipoles to various receivers. Also having program code and executable instructions in a plurality of computer processors communicatively coupled with and causing the active circuitry in cooperation with the EMVS device to determine angle of arrival and resolution of incoming wave vectors and polarization of incoming signals and to perform accurate high frequency geolocation through signal processing. Furthermore, the program code and executable instructions which perform calibration and antenna element placement determination also cause the system to collect data of known transmitted high frequency skywave signals, and estimate direction of arrival of unknown signals by detecting, resolving and measuring components of an electric field and a magnetic field at a single point.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an overall isometric view of a fully assembled electromagnetic vector sensor 100.

FIG. 2 illustrates a completed electromagnetic vector sensor 100 assembly showing spatially and orthogonally integrated dipole antenna and loop antenna elements.

FIG. 3 illustrates a close view of a crossover region of the dipole antenna and loop antenna elements and the mechanical configuration which isolates the dipole and loop antenna elements from each other (i.e., Loop/Dipole Cross Point Insulator 208), having a dielectric block as the Loop/Dipole Cross Point Insulator 208 and loop notches 304 shown in the loop antenna blades.

FIG. 4 illustrates loop antenna element feed points connected to a coupling section between the loop antenna elements and a loop electronics section, where the loop electronics section houses the loop antenna electronics; these elements are all contained in a portion of a base plate (platform).

FIG. 5 illustrates two coupling sections 502 which provide RF signals to the loop antenna circuitry mounted in the loop electronics 402 section, which contains electronics circuitry (i.e., such as active balun circuits 804) for the loop antenna elements (i.e., loop elements 204); these elements are also housed in portions of the base plate 702 platform.

FIG. 6 illustrates a dipole electronics assembly, which consists of an upper holder 602 and a bottom holder 606; and dipole electronic circuitry 604 is housed in the dipole electronics assembly.

FIG. 7 illustrates a base plate 702 (platform) of the electromagnetic vector sensor 100 apparatus. The base plate 702 serves as a mounting platform in which the loop antenna element(s) 204 are configured. Also, the base plate 702 serves as the platform upon which the electromagnetic vector sensor 100 assembly is mounted.

FIG. 8 illustrates loop antenna RF connections (i.e., loop coupling section to electronics 502) configured in portions of the base plate platform. In addition active circuitry 840 is also included in FIG. 8.

FIG. 8 illustrates loop RF connections 800 for the loop element(s) 204, as contained in a portion of the base plate 702, where portions of the base plate 702 platform include a loop holder 802, the loop coupling section to electronics 502 and active circuitry 840.

FIG. 9 illustrates loop antenna active circuitry and feed point(s) 210, as configured in portions of the base plate platform, where active circuitry 840 can include active loop balun circuit(s) 841 and active loop matching networks 842 (low impedance—see FIG. 31A and FIG. 31B).

FIG. 10 illustrates configuration and orientation of a first loop antenna element, such as loop element 204, as mounted in the base plate 702. The angle of the loop pairs (i.e., loop element 204) relative to the base plate 702 mounting platform is 54.74 degrees (i.e., the tilt angle of each loop pair is 54.74 degrees from the base plate of the loop holder assembly).

FIG. 11 illustrates configuration and orientation of the first loop antenna and a second loop antenna Loop Element(s) 204 of a plurality of antennae, as mounted in the base plate 702.

FIG. 12 illustrates configuration and orientation of the first loop antenna, the second loop antenna and a third loop antenna, as mounted in the base plate 702. Also, Loop/Dipole Cross Point Insulator(s) 208 are mounted, on the loop antenna elements.

FIG. 13 illustrates a dipole antenna support column 1302 vertically positioned in the bottom center of the base plate of the electromagnetic vector sensor 100 apparatus and provides support for the dipole antenna section.

FIG. 14 illustrates a bottom holder 606 (also called a bottom or lower dipole cap) section for mounting dipole antenna element(s) 204.

FIG. 15 illustrates balun circuitry 1502 for dipole antenna elements.

FIG. 16 illustrates an upper holder 602 section (also called an upper dipole cap) attached to the bottom holder 606 section, where both the upper holder 602 section and the bottom holder 606 section can be configured to hold a plurality of dipole antenna elements mounted in the electromagnetic vector sensor apparatus.

FIG. 17 illustrates at least three dipole antenna elements, such as dipole element(s) 202 of a plurality of dipole element(s) 202 mounted in the upper holder 602 section.

FIG. 18 illustrates a completed electromagnetic vector apparatus assembled with a plurality of loop and dipole antenna elements.

FIG. 19 illustrates the completed electromagnetic vector sensor 100 apparatus assembled and fielded, showing the length of a dipole element 202 being four feet (4′) long and the diameter of a loop element 204 being three feet (3′).

FIG. 20 illustrates the completed electromagnetic vector sensor 100 apparatus assembled, fielded, mounted on a three legged platform, and directionally situated having a true north indicator 2002 orientation.

FIG. 21 illustrates a close-in view of the completed dipole antenna holder 2102 where the upper holder 602 has been connected to and on top of the bottom holder 606 by use of a collar assembly, and where the completed dipole antenna holder 2102 contains the plurality of dipole antenna elements, such as dipole element(s) 202, as preferably mounted in the electromagnetic vector sensor 100 apparatus; and contains dipole active circuitry 604.

FIG. 22 illustrates a close-in view of the dipole antenna support column 1302 vertically positioned in the bottom center of the base plate 702 of the electromagnetic vector sensor 100 apparatus, where these portions of the base plate 702 contain active loop circuitry 840.

FIG. 23A illustrates one way EM propagation.

FIG. 23B illustrates a Range Doppler Plot with range separated ground wave, one-hop O and X, and two hop O and X modes.

FIG. 24 illustrates a description of the polarization state as the rotation of the E-field vector in the plane orthogonal to the direction of propagation where polarization is elliptical and is described by an ellipticity angle alpha (α) in radians and orientation angle beta (β) in radians.

FIG. 25 illustrates the two coordinate system for a two dimensional array manifold vector with azimuth defined from North to West and elevation defined from zenith to horizon.

FIG. 26A illustrates an isometric view of the completed electromagnetic vector sensor 100 assembly with orthogonal E-field dipoles and H-filed loops labeled.

FIG. 26B illustrates a top-down view of the completed electromagnetic vector sensor 100 assembly.

FIG. 26C illustrates EMVS E-filed dipole coordinate rotations applied about the Z axis, relative to the normal x, y, z axis, at 45 degrees.

FIG. 26D illustrates EMVS E-filed dipole coordinate rotations applied about the Y axis, relative to a varying x, y, z axis, at an Ez angle of 54.73 degrees.

FIG. 26E illustrates E-field rotation representations, upon realignment of E-field dipole antenna elements relative to original x, y, z cartization coordinate system.

FIG. 27A illustrates an estimated Az/El obtained with a single EMVS.

FIG. 27B illustrates an estimated Az/El obtained with a 2D array of three-EMVS.

FIG. 27C illustrates an estimated orientation/ellipticity of a single EMVS.

FIG. 27D illustrates an estimated orientation and ellipticity of three EMVS.

FIG. 28A illustrates estimated Az/El angle of arrival of O-mode signal of interest.

FIG. 28B illustrates signal Hop estimated left circular orientation/ellipticity of O-mode signal of interest.

FIG. 28C illustrates signal Hop estimated right circular orientation/ellipticity of X-mode signal of interest.

FIG. 28D illustrates signal Hop estimated Az/El of X-mode of signal of interest.

FIG. 29A illustrates a plot of estimated slant range, as a function kilometers verses UTC time.

FIG. 29B illustrates a plot of polarization ellipticity, as a function of radians verses UTC time.

FIG. 29C illustrates an azimuth plot, as a function of degrees verses UTC time.

FIG. 29D illustrates a plot of elevation, as a function of degrees and UTC time.

FIG. 30 illustrates the electromagnetic vector sensor 100 network (system) setup for center whip collection.

FIG. 31A illustrates an overhead view of single active loop matching networks (low impedance).

FIG. 31B illustrates a schematic view of single active loop matching networks (low impedance).

FIG. 31C illustrates an overhead view of 3 complete active dipole matching networks (high impedance).

FIG. 31D illustrates a schematic view of 3 active dipole matching networks (low impedance).

FIG. 32 illustrates In-Situ Calibration Processing flow chart.

FIG. 33 illustrates Quick Look Processing flow chart.

FIG. 34 illustrates active circuitry 840 and a network environment of an EMVS system.

DETAILED DESCRIPTION

Preferred exemplary embodiments of the present invention are now described with reference to the figures, in which like reference numerals are generally used to indicate identical or functionally similar elements. While specific details of the preferred exemplary embodiments are discussed, it should be understood that this is done for illustrative purposes only. A person skilled in the relevant art will recognize that other configurations and arrangements can be used without departing from the spirit and scope of the preferred exemplary embodiments. It will also be apparent to a person skilled in the relevant art that the exemplary embodiments can also be employed in other applications. Further, the terms “a”, “an”, “first”, “second” and “third” etc. used herein do not denote limitations of quantity, but rather denote the presence of one or more of the referenced items(s).

Referring to FIG. 1, FIG. 2, and FIG. 3, it can be seen that FIG. 1 illustrates an isometric view of an overall view of a completed electromagnetic vector sensor 100 assembly. FIG. 2 illustrates the completed electromagnetic vector sensor 100 assembly showing dipole antenna and loop antenna elements, including dipole elements 202, loop elements 204, loop/dipole cross point insulator(s) 208, loop feed point(s) 210, and dipole feed point(s) 212. FIG. 3 illustrates a close view of a crossover region of the dipole antenna and loop antenna elements and the mechanical configuration which provides orthogonal integration of the dipole elements 202 and the loop elements 204, and which isolates the dipole and loop antenna elements from each other (i.e., Loop/Dipole Cross Point Insulator 208, which includes a dielectric block as the Loop/Dipole Cross Point Insulator 208. Maintaining orthogonal integration of the antenna elements and maintaining isolation of the antenna elements are essential aspects of the exemplary embodiments.

Again referring to FIG. 3, the Loop/Dipole Cross Point Insulator 208 illustrated in FIG. 3 consists of a square piece of dielectric material which is used to support the dipole element(s) 202 and loop element(s) 204 sections. This piece of dielectric material (i.e., the dielectric material used as the Loop/Dipole Cross Point Insulator 208), which is used to support the dipole element(s) 202 and the lop element(s) 204, comprises the main focus of the instant invention. Loop antenna elements i.e., loop element(s) 204 consist of double and/or twin blade like circular sections of 50 mil thick aluminum. The blade portions are 2 inches in width. As illustrated in FIG. 3, the loop element(s) 204 are designed such that a pair of the blades forming loop element(s) 204 can be collocated side-by-side, such that the blades are isolated from each other. The distance between the loop blades is 0.95 inches apart. The Loop/Dipole Cross Point Insulator 208 provides the isolation, decoupling and mechanical support between the loop blades, as well as provides the structural layout and symmetry of the device. To maintain the decoupling of the double loop element(s) 204 from each other, a series of notches are cut into the loop elements, such that when the loops are integrated together the loops are not in electrical contact, while having sufficient mechanical support between the loop element(s) 204 and the dipole element(s) 202. Also, the Loop/Dipole Cross Point Insulator 208 provides the orthognallity between the loop element(s) 204 and the dipole element(s) 202, where the dipole element(s) 202 are inserted through the center of the dielectric material of the Loop/Dipole Cross Point Insulator 208 (see FIG. 3). Thus, the main advantages of this design, includes the ability to decouple both the dipole element(s) 202 from the loop element(s) 204 by using flat loop element(s) 204 in which small cut-outs and/or notches are used, such that when all of the loops are integrated together, the loops are not electrically touching each other or touching the dipoles; these design techniques provide the ability to maintain symmetry around the dipole element and maintain decoupling between the dipole element(s) 202 and the loop element(s) 204.

Referring to FIG. 2, FIG. 11, FIG. 12 and FIG. 18, integration of the dipole element(s) 202 with the loop element(s) 204 having dual loop design (also known as “loop pair”) provides increased operational bandwidth (BW), because orthogonallity of the antenna elements is achieved and maintained; then stable isolation between both the dipole element(s) 202 and loop element(s) 204 is maintained. Other advantages of exemplary embodiments disclosed herein include: (1) a smaller footprint than conventional array antenna sensors, (2) the ability to provide azimuth and elevation as well as polarization estimates, and (3) decoupling of antenna array elements, associated with dipole element(s) 202 and loop element(s) 204 integration. In addition, multiple loop element(s) 204 can be not only integrated with dipole element(s) 202, but can also be integrated with a plurality of loop element(s) 204 (see FIG. 11, FIG. 12 and FIG. 18).

Referring to FIG. 1, FIG. 2. FIG. 8, FIG. 10. FIG. 18, FIG. 19, and FIG. 30, in exemplary embodiments, a three element, six axis electromagnetic vector sensor 100 array assembly has operational characteristics which include an operational frequency range from about 3 MHz up to about 15 MHz, but ideally from about 3 MHz up to about 10 MHz with an optimum NF (noise figure) at 7 MHz and estimates direction of arrival and polarization for unknown signals. And, where, each loop element(s) 204 having dual loop design (also known as “loop pair”) is positioned with a tilt angle of each loop pair is about 54.74 degrees from the base of the loop holder 802 assembly.

Referring to FIG. 9, FIG. 31A, FIG. 31B, FIG. 31C, FIG. 31D and FIG. 34, active matching networks include low impedance matching networks, as well as high impedance matching networks and utilize high third-order intercept point (IP3) or (TOI) characteristics which provide a measure for nonlinear systems and devices and such IP3 characteristics concomitantly reduce the effects of interfering signals. The active circuitry 840 includes active loop balun circuit(s) 841, active loop matching networks 842 (low impedance—see FIG. 31A and FIG. 31B) or active dipole networks 843 (high impedance—see FIG. 31C and FIG. 31D). The system utilizes an algorithm unit 1230 having algorithms A1, A2, A3 . . . An, where A1 determines angle of arrival, A2 estimates direction of arrival of unknown signals, A3 determines polarization and computer program code (for process and/or method 2000 (see FIG. 34)) executed on computer processor(s) 1206, having memory 1208 residing in the computer processor (s) 1206, where the algorithms and code are required to discriminate polarization states of an incoming wavefront, provide increased accuracy in determining the direction of arrival of unknown signals, facilitate data collection of known transmitted high frequency skywave signals for achieving high frequency geolocation signal processing process and/or method 2000, to determining angle of arrival, and resolve incoming wave vectors (in elevation and azimuth directions) and polarization by measuring three complete components of the electric field and three components of the magnetic field of incoming signals, at a single point, by minimizing interactions between dipole and loop elements.

Referring to FIG. 34, further the external equipment consists of a display 1202 having a user interface 1204, memory 1208 having a dynamic repository 1210 having data repositories R90 through R94 up to Rn, where R90 can contain known skywave data 1211, R91 can contain electric field components data 1212, R92 can contain magnetic field components data 1214, R93 can contain unknown signal data 1216, R94 can contain elevation data 1218 and up to Rn, which can contain azimuth data 1220, all callable and executable by program code instructions (such as instructions from a method 2000 of geolocation processing code, which can reside in program unit 1240. Also, the external system may contain network interface 1270 modules, memory controller 1260 modules, I/O controller 1250 modules output devices 1254, input devices 1252, and can be connected in a network 1272 environment.

The completed electromagnetic vector sensor 100 can include at least three active loop matching networks 842 and at least three active dipole matching networks 843. For Active Network Calibration, each of the 3 dipole antenna (i.e., dipole element(s) 202, the bottom dipole end of each dipole element(s) 202 is physically positioned toward the center calibration whip using a counterclockwise 30 degree offset rotation, and frequency sweeps performed between 3 MHz to 15 MHz. The E-field dipole antenna, i.e., dipole element(s) 202 are then realigned to true north. Final antenna calibration is facilitated using a high fidelity model (based on method of moments) to determine antenna patterns for field site configuration. The high fidelity model includes active load matching and associated cables, for measurements collected. Because of active network variations/drift, each set of loop element(s) 204 and dipole element(s) requires both phase and amplitude alignment (i.e., matching calibration) to adjust for cable phase/amplitude variations and system receiver phase variations.

Referring to FIG. 32, regarding In-Situ Calibration processing, radar data waveform patterns are used to select a known 18×1 directional signal; then directional weighting using array manifold parameters of known directional transmit (tx) location, where

w=Z _(c) /a ₀  (1)

where w represents directional weighting;

where Z_(C) represents a known 18×1 directional signal; and

where a₀ represents an array manifold for a given theta (θ).

An 18×1 directional signal of interest is identified, as designated by Z_(i); then an array response for the signal of interest is normalized by calculated weights, where

Z′ _(i) =Z _(i) /w  (2)

where Z_(i) represents an 18×1 directional signal of interest;

where w represents directional weighting; and

where Z′_(i) represents a normalized array response for the signal of interest by calculated weights.

Assuming a right circular (RC) polarization array manifold (a_(rc)) and a left circular (LC) polarization array manifold (a_(lc)) estimation of the electromagnetic vector sensor Beamform, a refined Joint azimuth, elevation estimate is obtained.

Referring to FIG. 33 (also see FIG. 24), quick look mode processing requires acquiring and inputting a plurality of signal raw data for baseband processing. After range and Doppler processing in-situ known local waveform patterns are used to obtain calibration factors that are applied to Select Training O-mode and/or X-mode (O/X) transmissions. Whereby, estimates of azimuth and elevation are obtained.

Referring to FIG. 24, FIG. 25, and FIG. 33, Beamforming with a single electromagnetic vector signals is accomplished by defining a received signal y(t) as composed of signal and noise:

y(t)=a(Θ)s(t)+e(t)  (3),

where S(t) is the complex signal envelope and a(θ) is the array manifold defined for:

θ=[φ,ψ,α,β]^(T)  (4),

for a non-rotated x, y, z-axis, and

a(Θ)=B(φ,θ)Q(β)h(α)  (5),

where B(φ, ψ) is the steering matrix for azimuth φ∈[−π,π] and

elevation θ∈[−π/2, π/2], and

$\begin{matrix} {{B\left( {\varphi,\psi} \right)} = \begin{pmatrix} {v\left( {\varphi,\theta} \right)} & {\overset{\sim}{v}\left( {\varphi,\theta} \right)} \\ {\overset{\sim}{v}\left( {\varphi,\theta} \right)} & {- {v\left( {\varphi,\theta} \right)}} \end{pmatrix}} & (6) \\ {\left( {{v\left( {\varphi,\theta} \right)}\mspace{14mu} {\overset{\sim}{v}\left( {\varphi,\theta} \right)}} \right) = \begin{pmatrix} {{- \cos}\; \varphi \; \cos \; \theta} & {{- \sin}\; \varphi} \\ {{- \sin}\; \varphi \; \cos \; \theta} & {\cos \; \varphi} \\ {\sin \; \theta} & 0 \end{pmatrix}} & (7) \end{matrix}$

with rotation matrix Q(β), and h(β) representing the unit-norm vector for ellipticity of polarization

$\begin{matrix} {{Q(\beta)} = \begin{pmatrix} {\cos \; \beta} & {{- \sin}\; \beta} \\ {\sin \; \beta} & {\cos \mspace{11mu} \beta} \end{pmatrix}} & (8) \\ {{h(\alpha)} = \begin{pmatrix} {\cos \; \alpha} \\ {j\; \sin \; \alpha} \end{pmatrix}} & (9) \end{matrix}$

where Q(β)∈[0,π] is the polarization orientation angle and

$\alpha \in \left\lbrack {{- \frac{\pi}{4}},\frac{\pi}{4}} \right\rbrack$

is the polarization ellipticity angle (see A. Nehorai, K. S. Ho, and T. T. G. Tan, “Minimum-Noise-Variance Beamformer with an Electromagnetic Vector Sensor,” IEEE Trans. Signal Processing, vol. 47, pp. 601-618 March 1999).

Again referring to FIG. 25 and FIG. 30 concerning a 2D EMVS Array Manifold Vector, an EMVS positioning and/or placement can be setup in spatial 2D triangular formation with spatial positions defined by Xk, where k is defined as:

$\begin{matrix} {K = {{v\mspace{14mu} x\mspace{14mu} \overset{\sim}{v}} = \begin{pmatrix} {{- \cos}\; \varphi \; \sin \; \Theta} \\ {{- \sin}\; \varphi \; \sin \; \Theta} \\ {{- \cos}\; \Theta} \end{pmatrix}}} & (10) \end{matrix}$

For 3 element 2D array, X is a 3×3 matrix representing the relative sensor positions and/or placement (see FIG. 25 and FIG. 30).

Conventional spatial beamforming weights are then obtained as:

$\begin{matrix} {w = {v \otimes a}} & (11) \\ {{{for}\mspace{14mu} v} = {^{j\frac{2\pi}{\lambda}{Xk}}.}} & (12) \end{matrix}$

For a Single EMVS Manifold Vector, the constructed EMVS is defined with a rotation relative to the normal x, y, z-axis. Referring to FIG. 26C, the rotation about the z-axis is defined for angle θ_(Z) as:

$\begin{matrix} {{R_{z}\left( \theta_{z} \right)} = \begin{pmatrix} {\cos \; \theta_{z}} & {{- \sin}\; \theta_{z}} & 0 \\ {\sin \; \theta_{z}} & {\cos \; \theta_{z}} & 0 \\ 0 & 0 & 1 \end{pmatrix}} & (13) \end{matrix}$

Referring to FIG. 26D and FIG. 26E, the rotation about the y-axis is defined for angle θ_(y) as:

$\begin{matrix} {{R_{y}\left( \theta_{y} \right)} = \begin{pmatrix} {\cos \; \theta_{y}} & 0 & {{- \sin}\; \theta_{y}} \\ 0 & 1 & 0 \\ {\sin \; \theta_{y}} & 0 & {\cos \; \theta_{y}} \end{pmatrix}} & (14) \end{matrix}$

The 6×6 rotation matrix for the E1, E2, E3 dipole and H1, H2, H3 loop sensors is:

R(θ_(y),θ_(z))=I

(R _(z)(θ_(z))R _(y)(θ_(y)))  (15)

The 6×1 array manifold vector is:

a(θ_(y),θ_(z),φ,θ,β,α)=R(θ_(y),θ_(z))B(φ,θ)Q(β)h(α)  (16).

While the exemplary embodiments have been particularly shown and described with reference to preferred embodiments thereof, it will be understood, by those skilled in the art that the preferred embodiments have been presented by way of example only, and not limitation; furthermore, various changes in form and details can be made therein without departing from the spirit and scope of the invention. Thus, the breadth and scope of the present exemplary embodiments should not be limited by any of the above described preferred exemplary embodiments, but should be defined only in accordance with the following claim and/or claims and their equivalents. Any and/or all references cited herein are each entirely incorporated by reference herein, including all data, tables, figures, and text presented in the cited references. Also, it is to be understood that the phraseology or terminology herein is for the purpose of description and not of limitation, such that the terminology or phraseology of the present specification is to be interpreted by the skilled artisan in light of the teachings and guidance presented herein, in combination with the knowledge of one of ordinary skill in the art. The foregoing description of the specific embodiments will so fully reveal the general nature of the invention that others can, by applying knowledge within the art, readily modify and/or adapt for various applications such specific embodiments, without undue experimentation, without departing from the general concept of the exemplary embodiments. Therefore, such adaptations and modifications are intended to be within the meaning and range of equivalents of the disclosed embodiments, based on the teaching and guidance presented herein. 

What is claimed is:
 1. An electromagnetic vector sensor (EMVS) system, the EMVS system comprising: a plurality of EMVS devices each consisting of a plurality of loop antenna elements spatiatally orthogonally integrated with and electrically isolated from a plurality of dipole antenna elements, mounted on a rotatably adjustable platform having a true north orientation; and a plurality of active circuitry residing in antenna holding housings and having a software program code, and executable instructions in a plurality of computer processors causing the active circuitry in cooperation with each EMVS device of the plurality of EMVS devices and multiple RF receivers to determine angle of arrival and resolution of incoming wave vectors and polarization of incoming signals and to perform accurate high frequency geolocation signal processing, wherein said software program code and executable instructions which perform calibration and antenna element placement determination operations and cause the system to collect data of known transmitted high frequency skywave signals, and estimate direction of arrival of unknown signals by detecting, resolving and measuring components of an electric field and a magnetic field at a single point.
 2. The EMVS system of claim 1, wherein each EMVS device of the plurality of EMVS devices further comprises a base plate composed of a group of loop RF connections mechanically and electrically attached in a spoke formation to a centerpiece comprising a dipole antenna support column, wherein the group of loop RF connections contains at least a first loop RF connection, a second loop RF connection and a third loop RF connection, wherein at least each of the first; second and third loop RF connections of the group of loop RF connections contains, a first, second and third loop holder having inserted within each of the first, second and third loop holder, and a first, second and third loop coupling section to electronics, and wherein each of the first, second and third loop coupling section to electronics contains the plurality of active circuitry.
 3. The EMVS system of claim 1, wherein each EMVS device further comprises a first loop element inserted into the first loop holder, wherein the first loop element is composed of at least a first double blade circular section, wherein the first double blade circular section contains at least two loop/dipole cross point insulators inserted between each blade of the first double blade circular section at diametrically opposed poles of the first double blade circular section, forming a first upper loop/dipole cross point insulator and a first lower loop/dipole cross point insulator pair.
 4. The EMVS system of claim 1, wherein each EMVS device further comprises a second loop element inserted into the second loop holder, wherein the second loop element is composed of at least a second double blade circular section, wherein the second double blade circular section contains at least two loop/dipole cross point insulators inserted between each blade of the second double blade circular section at diametrically opposed poles of the second double blade circular section, forming a second upper loop/dipole cross point insulator and a second lower loop/dipole cross point insulator pair.
 5. The EMVS system of claim 1, wherein each EMVS device further comprises a third loop element inserted into the third loop holder, wherein the third loop element is composed of at least a third double blade circular section, wherein the third double blade circular section contains at least two loop/dipole cross point insulators inserted between each blade of the third double blade circular section at diametrically opposed poles of the third double blade circular section, forming a third upper loop/dipole cross point insulator and a third lower loop/dipole cross point insulator pair, wherein each of the at least two loop/dipole cross point insulators inserted between each blade of the first, second and third double blade circular sections mechanically connects the first, second, and third loop elements together providing mechanical stability and orthogonality between the first, second, and third loop elements, wherein each loop/dipole cross point insulator has a rectangular cube-like shape and wherein each loop/dipole cross point insulator contains a center cut circular hole traversing a center axis of the loop/dipole cross point insulator, where the center cut hole traverses in a direction from pole to pole of each double blade circular section.
 6. The EMVS system of claim 1, wherein each EMVS device further comprises a bottom dipole holder mechanically attached to the dipole antenna support column, at the top of the dipole antenna support column.
 7. The EMVS system of claim 1, wherein each EMVS device further comprises three separate dipole balun circuitry elements residing between the upper and lower bottom dipole holder.
 8. The EMVS system of claim 1, wherein each EMVS device further comprises an upper dipole holder mechanically covering the dipole balun circuitry element and mechanically attached to the bottom dipole holder, wherein the upper dipole holder and the bottom dipole holder contain a plurality of circular dipole holding holes machined to correspond with the direction of each center cut hole traversing each of the first, second and third loop/dipole cross point insulator in a direction from pole to pole of each of the first, second and third double blade circular section respectively.
 9. The EMVS system of claim 1, wherein each EMVS device further comprises a first upper dipole antenna element inserted into the first upper loop/dipole cross point insulator of the first upper loop/dipole cross point insulator and the first lower loop/dipole cross point insulator pair, wherein the first upper dipole antenna element extends from the first upper loop/dipole cross point insulator into a first circular dipole holding hole of the plurality of circular dipole holding holes in the upper dipole holder, and where the first upper dipole antenna element is electrically connected to the dipole balun circuitry.
 10. The EMVS system of claim 1, wherein each EMVS device further comprises a second upper dipole antenna element inserted into the second upper loop/dipole cross point insulator of the second upper loop/dipole cross point insulator and the second lower loop/dipole cross point insulator pair, wherein the second upper dipole antenna element extends from the second upper loop/dipole cross point insulator into a second circular dipole holding hole of the plurality of circular dipole holding holes in the upper dipole holder, and where the second upper dipole antenna element is electrically connected to the dipole balun circuitry.
 11. The EMVS system of claim 1, wherein each EMVS device further comprises a third upper dipole antenna element inserted into the third upper loop/dipole cross point insulator of the third upper loop/dipole cross point insulator and the third lower loop/dipole cross point insulator pair, wherein the third upper dipole antenna element extends the third upper loop/dipole cross point insulator into a third circular dipole holding hole of the plurality of circular dipole holding holes in the upper dipole holder, and where the third upper dipole antenna element is electrically connected to the dipole balun circuitry.
 12. The EMVS system of claim 1, wherein each EMVS device further comprises a first lower dipole antenna element inserted into the first lower loop/dipole cross point insulator of the first upper loop/dipole cross point insulator and the first lower loop/dipole cross point insulator pair, wherein the first lower dipole antenna element extends from the first lower loop/dipole cross point insulator into a first circular dipole holding hole of the plurality of circular dipole holding holes in the lower dipole holder, and where the first lower dipole antenna element is electrically connected to the dipole balun circuitry.
 13. The EMVS system of claim 1, wherein each EMVS device further comprises a second lower dipole antenna element inserted into the second lower loop/dipole cross point insulator of the second upper loop/dipole cross point insulator and the second lower loop/dipole cross point insulator pair, wherein the second lower dipole antenna element extends from the second lower loop/dipole cross point insulator into a second circular dipole holding hole of the plurality of circular dipole holding holes in the lower dipole holder, and where the second lower dipole antenna element is electrically connected to the dipole balun circuitry.
 14. The EMVS system of claim 1, wherein each EMVS device further comprises a third lower dipole antenna element inserted into the third lower loop/dipole cross point insulator of the third upper loop/dipole cross point insulator and the third lower loop/dipole cross point insulator pair, wherein the third lower dipole antenna element extends the third lower loop/dipole cross point insulator into a third circular dipole holding hole of the plurality of circular dipole holding holes in the lower dipole holder, and where the third lower dipole antenna element is electrically connected to the dipole balun circuitry, wherein each EMVS device has an operational range from about 3 MHz up to about 15 MHz, with an optimum NF at 7 MHz.
 15. An electromagnetic vector sensor (EMVS) device, the EMVS device comprising: a base plate composed of: a group of loop RF connections mechanically and electrically attached in a spoke formation to a centerpiece comprising a dipole antenna support column, wherein the group of loop RF connections contains at least a first loop RF connection, a second loop RF connection and a third loop RF connection, and wherein at least each of the first; second and third loop RF connections of the group of loop RF connections contains: a first, second and third loop holder having inserted within each of the first, second and third loop holder: a first, second and third loop coupling section to electronics, wherein each of the first, second and third loop coupling section to electronics contains active circuitry residing in a housing of the base plate; a first loop element inserted into the first loop holder, wherein the first loop element is composed of at least a first double blade circular section, wherein the first double blade circular section contains at least two loop/dipole cross point insulators inserted between each blade of the first double blade circular section at diametrically opposed poles of the first double blade circular section, forming a first upper loop/dipole cross point insulator and a first lower loop/dipole cross point insulator pair; a second loop element inserted into the second loop holder, wherein the second loop element is composed of at least a second double blade circular section, wherein the second double blade circular section contains at least two loop/dipole cross point insulators inserted between each blade of the second double blade circular section at diametrically opposed poles of the second double blade circular section, forming a second upper loop/dipole cross point insulator and a second lower loop/dipole cross point insulator pair; a third loop element inserted into the third loop holder, wherein the third loop element is composed of at least a third double blade circular section, wherein the third double blade circular section contains at least two loop/dipole cross point insulators inserted between each blade of the third double blade circular section at diametrically opposed poles of the third double blade circular section, forming a third upper loop/dipole cross point insulator and a third lower loop/dipole cross point insulator pair, wherein each of the at least two loop/dipole cross point insulators inserted between each blade of the first, second and third double blade circular sections mechanically connects the first, second, and third loop elements together providing mechanical stability and orthogonality between the first, second, and third loop elements, wherein each loop/dipole cross point insulator has a rectangular cube-like shape and wherein each loop/dipole cross point insulator contains a center cut circular hole traversing a center axis of the loop/dipole cross point insulator, where the center cut hole traverses in a direction from pole to pole of each double blade circular section; a bottom dipole holder mechanically attached to the dipole antenna support column, at the top of the dipole antenna support column; a dipole balun circuitry element residing on the bottom dipole holder; an upper dipole holder mechanically covering the dipole balun circuitry element and mechanically attached to the bottom dipole holder, wherein the upper dipole holder and the bottom dipole holder contain a plurality of circular dipole holding holes machined to correspond with the direction of each center cut hole traversing each of the first, second and third loop/dipole cross point insulator in a direction from pole to pole of each of the first, second and third double blade circular section respectively; a first upper dipole antenna element inserted into the first upper loop/dipole cross point insulator of the (first upper loop/dipole cross point insulator and the first lower loop/dipole cross point insulator pair), wherein the first upper dipole antenna element extends from the first upper loop/dipole cross point insulator into a first circular dipole holding hole of the plurality of circular dipole holding holes in the upper dipole holder, and where the first upper dipole antenna element is electrically connected to the dipole balun circuitry; a second upper dipole antenna element inserted into the second upper loop/dipole cross point insulator of the (second upper loop/dipole cross point insulator and the second lower loop/dipole cross point insulator pair), wherein the second upper dipole antenna element extends from the second upper loop/dipole cross point insulator into a second circular dipole holding hole of the plurality of circular dipole holding holes in the upper dipole holder, and where the second upper dipole antenna element is electrically connected to the dipole balun circuitry; a third upper dipole antenna element inserted into the third upper loop/dipole cross point insulator of the (third upper loop/dipole cross point insulator and the third lower loop/dipole cross point insulator pair), wherein the third upper dipole antenna element extends from the third upper loop/dipole cross point insulator into a third circular dipole holding hole of the plurality of circular dipole holding holes in the upper dipole holder, and where the third upper dipole antenna element is electrically connected to the dipole balun circuitry; a first lower dipole antenna element inserted into the first lower loop/dipole cross point insulator of the (first upper loop/dipole cross point insulator and the first lower loop/dipole cross point insulator pair), wherein the first lower dipole antenna element extends from the first lower loop/dipole cross point insulator into a first circular dipole holding hole of the plurality of circular dipole holding holes in the lower dipole holder, and where the first lower dipole antenna element is electrically connected to the dipole balun circuitry; a second lower dipole antenna element inserted into the second lower loop/dipole cross point insulator of the (second upper loop/dipole cross point insulator and the second lower loop/dipole cross point insulator pair), wherein the second lower dipole antenna element extends from the second lower loop/dipole cross point insulator into a second circular dipole holding hole of the plurality of circular dipole holding holes in the lower dipole holder, and where the second lower dipole antenna element is electrically connected to the dipole balun circuitry; and a third lower dipole antenna element inserted into the third lower loop/dipole cross point insulator of the (third upper loop/dipole cross point insulator and the third lower loop/dipole cross point insulator pair), wherein the third lower dipole antenna element extends from the third lower loop/dipole cross point insulator into a third circular dipole holding hole of the plurality of circular dipole holding holes in the lower dipole holder, and where the third lower dipole antenna element is electrically connected to the dipole balun circuitry: a true north indicator mechanically connected to the base plate, wherein the true north indicator is rotatably adjustable and when the true north indicator is adjusted causing the EMVS to be directionally situated in a true north orientation, the EMVS accurately receives high frequency geolocation signals; and a computer processor residing external to the EMVS device, wherein the computer processor contains program code processing algorithms having instructions which determine angle of arrival and resolution of incoming wave vectors and polarization of incoming signals and performs accurate high frequency geolocation signal processing.
 16. The EMVS device according to claim 15, wherein each blade of double blade circular sections are flat blades 2 inches in width and are collocated side by side, spaced at least 0.95 inches apart from each other, and wherein the EMVS device has an operational range from about 3 MHz up to about 15 MHz with an optimum noise figure at 7 MHz, and wherein a tilt angle of each loop pair is 54.74 degrees from the base plate of the loop holder assembly.
 17. The EMVS device according to claim 15, wherein each blade is composed of 50 mil thick aluminum.
 18. The EMVS device according to claim 15, wherein loop/dipole cross point insulators provide isolation, electrical decoupling, mechanical symmetry and mechanical support between loop elements and dipole element blades, wherein notches cut into loop elements to maintain electrical decoupling of loop elements from each other, thus causing orthogonallity between all loop elements and all dipole elements, and wherein dipole elements are composed of electrically conducting materials.
 19. The EMVS device according to claim 15, wherein dipole elements are at least 4 feet long and wherein loop elements are at least 3 feet in diameter.
 20. The EMVS device according to claim 15, wherein loop elements are composed of a plurality of blade elements, wherein the plurality of blade elements consists of at least two or more blades. 